rhodium scrap price.

admin1 Precious metals 2021-04-08 08:53 0

 
   Where is the precious metal recycling in Fuzhou? The technology about the price of Rhodium scrap in Fuzhou, the board. On the obtained precious metal-plated recovered and refined copper plate, use the precious metal recovery and extraction wettability tester, and put the precious metal recovery and extraction eutectic precious metal recovery and extraction silver content and weight into the container, at the temperature of. The wettability of solder rhodium scrap is tested in rosin application, immersion depth and air. The relationship between the thickness and the weight of the silver content and the wetting time of the noble metal recovery and refining rhodium waste gouache slag plating is shown in the table and the relationship between the composition of the precious metal recovery and refining rhodium waste gouache slag film is about the thickness and the wetting time in the table The appearance of the immersed part after the wettability test shown in is not confirmed. All the precious metals are recovered and refined. The toughness, which is a glossy and photosensitive resin film coated with resist, which has a thickness of about 10 meters. Pure copper plate, and using photolithography to form a total of holes in the diameter of meters and the resist space in each of the meters using the photolithography printing recycling technology. The copper plate is bare. In this hole, precious metal recycling and refining electroplating is performed with a thickness of approximately? Use the plating bath described in the examples, and do not stir under the condition that the current density is equal to and. After plating, the resist was peeled off, and the plating part of the gouache slag of the plating precious metal recovery and extraction rhodium scrap was observed with an electron microscope. As a result, the plating layer is faithfully formed into the shape of the resist hole. In addition, the result of analyzing the composition of this plating material by an electron beam analyzer is that the plating material is made of the precious metal recovered and refined rhodium waste water powder slag with the weight of silver content and uneven composition in the thickness direction.


 
   In the plating bath of the example, when the resist was immersed in the plating bath for plating, no peeling of the resist was observed. In addition, it is preferable that the resist is non-photosensitive. In this case, the resist is formed in a predetermined pattern, where is Shangqiu Precious Metal Recycling Company. And it can be performed by laser processing such as excimer laser. When a semiconductor chip is selected as the object to be plated and the precious metal recovery and extraction rhodium scrap gouache slag plating is performed on the semiconductor chip, the plating material is melted in a hydrogen atmosphere in the same manner as above, thereby obtaining a hemispherical plating product. When the semiconductor chip is connected to the Phillips chip, this plating material can be suitably used as a bump terminal for external connection. In addition, the resist is selected so as to have a resin substrate with a wiring pattern made of copper. For example, a board for a ball grid having a copper wiring pattern on the surface to be electroplated is selected, and a board for use on the wiring pattern is exposed The part that forms the external connection terminal. After being formed on the resin substrate in the same manner as described above, precious metal recovery refining plating is performed on the exposed portion of the wiring pattern to form bump terminals for external connection, and it can be formed as a target. Where is Anshan Precious Metal Recycling Company. A wiring pattern formed by coating a resist on a polyimide film with a thickness of approximately about the thickness of the photosensitive resin film to be plated on a polyimide film is formed on a pure copper plate, and a photolithography method is used to form a total of horizontal and vertical holes The diameter is the interval in meters in meters in the lithographic recovery technology using resist.


 
   Approximately the rhodium scrap exposed in the first nickel-plated hole? Next, in the example, without stirring, the plating bath described in the above was used to perform current density plating under the condition that the amount of electricity was set to equal to one. After plating, the resist was peeled off, and the plating was observed under an electron microscope. As a result, the plating layer grows to be thicker than the thickness of the resist, and the protrusions on the resist are formed in the form of antlers into a hemispherical shape larger than the diameter of the hole. The material coated with antlers was melted in a hydrogen atmosphere, and the appearance was observed again through an electron microscope. As a result, a shape with a diameter of approximately hemispherical and a height are obtained. As a result of analyzing the cross-section of the hemisphere by an electron beam microanalyzer, the silver and rhodium scraps are uniformly distributed in the hemisphere and the content of silver is the weight. It is also preferred that the resist is not photosensitive. Where is the Zhanjiang precious metal recycling company. In this case, when the resist is formed in a predetermined pattern, it can be performed by laser processing such as an excimer laser. When semiconductor chips are selected as the object to be plated, gouache plating of precious metal recovery and extraction of rhodium scrap is carried out. The semiconductor chip is manufactured in the same manner as described above, and the plating is melted in a hydrogen atmosphere, thereby obtaining a hemispherical plating. In the case of flip-chip connection of semiconductor chips, such a plating material can be suitably used as a bump terminal for external connection. In addition, a resin substrate with a wiring pattern made of copper on the surface of the plating material, for example, a substrate for a spherical grid lane is selected, and the resist is exposed, thereby exposing the wiring pattern formed on the wiring pattern for external connection Part of the terminal. After the same formation on the resin substrate, the exposed part of the wiring pattern is plated with precious metal recovery and refining plating to form bump terminals for external connection, and the bump formation area of ??the wiring pattern formed by it can be used as Object. The effect of the recovery technology is as described above. The aqueous solution for the formation of metal complexes in the recovery technology can make a variety of gold


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