Iridio a la venta

admin1 Precious metals 2021-04-08 09:58 0

 
   Where is the recovery of iris flowers in Jingzhou? Regarding the technology of palladium, platinum and rhodium recovery in Jingzhou, the structure includes at least the first substrate and the first iris recovery and refining ball connected to the first conductive pad reorganized to the first substrate, wherein the first iris The flower recovery refining ball includes the palladium platinum rhodium water powder slag refining the iris flower, wherein the palladium platinum rhodium water powder slag is basically lead-free, and the palladium platinum rhodium water powder slag includes waste palladium platinum rhodium, silver and copper, wherein the palladium platinum The rhodium water powder slag has a weight percentage of at least about 10%, and wherein the palladium platinum rhodium water powder slag has a copper concentration not exceeding weight, the second substrate and the second conductive pad replaced to the second substrate, wherein the first solder The ball is replaced with the second heat exchanger, wherein the first iris flower recovery and refined ball can be melted by heating to form a changed iris flower recovery and refined ball, wherein the modified iris flower recovery and refined ball is cooled to a solid phase The waste palladium, platinum and rhodium nucleus grows at a low temperature for solidification, wherein the low temperature corresponds to the cooling associated with the eutectic temperature of the palladium, platinum and rhodium water powder slag, and the solidified change iris recovery refining ball is connected to the first substrate and The solder joints of the second substrate, and the change in the weight percentage concentration of silver in the iris recovery refining ball is very small, where is the Yancheng iris recovery company.

 
Therefore, η can be substantially suppressed during cooling. The composition of the board In a specific embodiment, regarding the recycling technology, a post-weld electronic structure is provided, which includes at least a first substrate and a second substrate, wherein the first iris recovery ball is coupled to the two substrates through solder joints . The solder joints include at least one palladium platinum rhodium water powder slag, wherein the palladium platinum rhodium water powder slag is actually lead-free, and the palladium platinum rhodium water powder slag includes waste palladium platinum rhodium, silver and copper. The palladium platinum rhodium water powder slag has a concentration of at least weight percent, and the weight percent concentration of silver in the palladium platinum rhodium water powder slag is such that the weight percent concentration of copper in gold does not exceed the board where the small system appears to the solder joint. Regarding the recycling technology, it provides a reliable low-melting, basically lead-free iris recycling and refining ball, which is used to bond the wafer chip tape to the circuit board, or to gently bond the integrated circuit chip to the circuit board. Wafer carrier tape. The figure inserts a cross-sectional view of an electronic combination such as an electronic packaging structure. According to a specific embodiment of the recycling technology, the substrate must be soldered to the substrate. Conductive substitution substitutes for connection to the substrate, and solder balls swaps for substitution. For example, the ball may contact the pad, for example, metallurgically and or electrically. Therefore, the substrate, bond pads and solder balls are coupled together into a single mechanical unit. The solder balls have passed through any recycling technique known to those skilled in the art, in particular, for example, remelting the solder balls to couple the solder pads to the solder pads, and then cooling the solder balls so that the highest quality of the combination of solder balls is the solidification of the soldering technique. The iris flower recycling and refining pad is attached to the substrate, and then solder paste is applied on the iris flower recycling and refining pad to contact the iris flower recycling and refining pad. The substrate can be soldered to the substrate by heating, and the solder paste and solder balls can be melted and remelted,


 
   so that the melted and remelted iris from the solder paste can be recovered and refined into the solder balls to form the first one. The picture shows the solder balls that have been changed. The solder balls include at least solder waste palladium platinum rhodium paste and solder balls. During the above-mentioned melting and remelting welding, the solder balls are mixed with the solder paste of the solder balls. After cooling and solidification, the solder balls are changed to serve as solder joints for coupling the substrate to the substrate. In some embodiments, it is not necessary to use solder paste when making connections between the substrate and the substrate. In this embodiment, only flux is used to assist the soldering process. In other specific embodiments, solder paste can be used to connect the substrate and the solder balls, where the solder balls do not melt, but are attached to the cured iris by immersing in the solder paste under remelting conditions. Will be pasted on the iris recovery and extraction. In the picture, where is the Jinzhou Iris Recycling Company. The electronic structure can be referred to as a front-welded electronic structure. The figure shows the electronic structure in the figure. According to a diagram regarding a specific embodiment of recycling technology. After soldering the substrate to the substrate, the solder paste and solder balls are completely melted. As shown in the figure, the cured modified solder balls can be used as solder joints for coupling the substrate to the substrate. The changed solder ball includes at least the material of the solder ball and the material of the solder paste as shown in the figure. Generally speaking, each solder ball is mechanically and electrically coupled to the substrate to the substrate, and each of the solder balls represents a changed solder ball. In the figure, the electronic structure can be called the electronic structure after welding. In an alternative embodiment, based on the recycling technology that does not use iris recovery to extract solder paste, but instead uses fluxes known to those skilled in the art, where is the Hanzhong iris recycling company. Instead of coupling the solder ball to the pad. The solder balls have been changed to basically include solder balls instead of any solder paste. In another embodiment, according to the recycling technology, no flux or solder paste is used to connect the solder balls and the solder pads. About recycling technology. In the figures, the substrate and each may include any electrical


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